LaGrange, Ohio.  Inservco, Inc. announces that it has acquired a new Heller 1809EXL 11-zone (9 heating and 2 cooling) reflow oven. The new system will allow Inservco to meet advanced reflow applications from around the world optimizing lead-free reflow. The result of Heller's reconfigured zone design with higher efficiency heater modules and increases in the number of reflow zones, Heller EXL ovens are prepared to meet the higher temperature requirements of lead-free profiles.

Inservco, a leading manufacturer of today's complex printed circuit board assemblies (PCBAs), must deal with many conflicting priorities to be successful and profitable. The Heller system utilizes an advanced air management technology maximizing the two critical reflow variables: air velocity and air volume. Thus, the highest level of convective heat transfer is achieved, and the flow of air is balanced throughout the oven. An internal oxygen sensor and proportioning valve is used to minimize nitrogen consumption, and related costs by up to 50%. For today's manufacturers, success -- and in some cases survival -- depends on doing everything right.

Inservco's high quality services and products have been developed through its Customer Focus Team and Continuous Improvement Teams, implementing several Lean Initiatives. Investment in equipment and training are clear indicators that Inservco will continue working towards achieving its customers' quality requirements and making strides for higher levels of customer satisfaction in the EMS industry.

"Quality is and has always been the key element in our strategy for success"

Inservco is a leading provider of electronic manufacturing services including design, circuit board assembly and test, materials management, and box build. Since our inception in 1968, our goal has been to exceed our customers’ expectations. Inservco is based in LaGrange, Ohio and certified to ISO 9001:2000 standards.