Through-Hole (THT)

Inservco maintains a full array of Through-Hole assembly equipment including:

• Automatic Universal T-85 Axial Inserts
• Automatic Universal DIP Inserters
• An Automatic Sequencer to support the inserts.

Semiautomatics include two CS 400 D inserters.

The Through-Hole process is supported by a recently installed Technical Devices Nu/Era wave soldering station.  The wave solder features top/bottom preheaters and dual wave technology.  Rails can accommodate PCB up to 24" wide.

A Triton Aqueous cleaner backs up the Through-Hole process and uses De-ionized water.

Our manufacturing processes now allows for standard as well as Lead-Free Design.

Advanced Device Placement

Placement accuracy and reflow of Ball Grid arrays are verified utilizing the Teradyne GR-X.  If your engineering department needs to rework advanced components, Inservco can meet those needs with the Gen Rad 1100 rework station.  This system allows removal and highly accurate placement of BGA, Micro BGA, Flip Chip, and Multi-Chip modules.

Final Product Assembly
Box-Build

 

UniversalDIP Interface Inserter Automated Through Hole

Surface Mount (SMT)

Inservco operates five SMT lines.  These units include three fully integrated in-line production lines, one of the which is high speed.

There are also two dedicated specialty lines utilized for short run requirements.  The specialty lines are pick and place work stations.  The Triton Aqueous cleaner supports the SMT processes as well.

All principal line devices are supplied by Juki and Tyco. The in-line units include chip shooters, fine pitch modules and advanced nine-zone Heller lead-free reflow ovens.

SMT may now be applied to boards using Lead-Free Design.

Box Build

Inservco has performed final product assembly and Box-Build since its founding in 1968.  This includes:

• Sheet Metal
  
• Front Panel labels
  
• Harness
• Power Supplies
• Transducers
• Shipping/Installation document
• Shipping Carton (ESD)
  

Currently the company assembles products ranging from small, simple electronic hand-held device kits to complex electronic medical instrument products with five component modules and a total aggregate weight of more than 200 pounds.